Integrating semiconductor chips directly onto flexible substrates to eliminate packaging bulk.
Achieve ultimate thinness and high-density connectivity with our industry-leading die-bonding precision. Our flexible COB (Chip-on-Board) solutions are engineered for the most demanding miniaturized electronics.
Leading-Edge COB Integration Parameters
Die Bonding Precision
Wafer offset angle tolerance within ±5°
Packaging Thickness
Encapsulation controlled within 50-100μm (±25μm)
Ultra-Fine Dam
Encapsulation thickness tolerance reaches ±5μm
Wire Bonding
High-reliability gold/aluminum wire bonding or Flip-Chip
Overcoming the Challenges of Flexible Substrates
Bonding chips to flexible substrates is notoriously difficult due to material unevenness. FlexPlus utilizes Innovative Magnetic Fixture Technology to ensure a perfectly flat surface during the micron-level packaging process, ensuring 99.9% bonding reliability.
Our systematic approach addresses thermal management and mechanical stress, allowing chips to maintain peak performance even when the substrate is subjected to dynamic bending.
Key Advantages
- Ultimate Thinness: Replaces traditional bulky SMT packages with direct die attachment.
- Thermal Efficiency: Direct thermal path from chip to flexible substrate.
- Enhanced Reliability: Fewer solder joints means fewer points of failure in dynamic environments.
- Cleanroom Quality: 100% manufacturing in a controlled environment to ensure zero wafer contamination.
Precision Performance Where Size Matters Most
AR/VR & Smart Glasses
Ultra-compact display drivers and sensor integration for lightweight wearables.
Optical Transceivers
High-speed data transmission modules requiring micron-level alignment.
Medical Implants
Biocompatible, high-density circuits for neurostimulators and diagnostic pills.
High-End Consumer Tech
Enabling sleek designs in smartphones and premium smartwatches.
Global Leader in Flexible COB Technology
Systematic Solutions
Mature flexible COB process standards refined over 20 years.
Micron-Precision Packaging
Specialized equipment for ultra-fine dam and encapsulation control.
In-House Cleanroom
Manufacturing performed in controlled environments to prevent wafer contamination.
Engineering Partnership
Collaborative design support to optimize chip-to-flex layouts for maximum yield.
Engineered for Zero-Defect Performance
Start Your Miniaturization Project
Looking for a partner to push the boundaries of thinness and density? Our engineering team is ready to review your chip specifications and provide a technical COB assessment.