Flex PCB Manufacturing Capabilities

Technical Specifications & Engineering Support

Explore our comprehensive flexible PCB manufacturing capabilities. From detailed technical specifications to advanced processing techniques, this page serves as your complete technical reference guide for partnering with Flex Plus on your next project.

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TECHNICAL SPECIFICATIONS

Comprehensive Manufacturing Capabilities

Detailed technical specifications for flexible and rigid-flex PCB manufacturing

Capability	Specification
Board Type	Single-Sided FPC / Double-Sided FPC / Multilayer FPC (3-8 Layers) / Rigid-Flex PCB (2-12 Layers) / Dual-Access FPC (Bare Back FPC) / Split FPC / Sculptured FPC / TPU Circuit
Board Size	Standard length: Up to 1.6 meters Specialized length: Up to 4 meters TPU Circuit: 10-600mm
Board Thickness	TPU substrate: 0.15-1.0mm Note: Varies by product type and layer count
Ultra-Thin Design	Down to 25 micron with gold plating on Double-Sided Flex PCB
Minimum Line Width/Space	0.05mm / 0.05mm (2mil/2mil)
Copper Weight	18μm – 70μm (½ oz – 2 oz) TPU Circuit: 18-70μm copper foil
Base Material	Polyimide (PI) / FR-4 / Thermoplastic Polyurethane (TPU)
Max Layer Count	Flexible PCB: 8 layers Rigid-Flex PCB: 12 layers
Circuit Layers (TPU)	1-2 layers
Special Features	• Flexible heat dissipation flow channels • Transparent PCB (transparency ≥ 90%) • 3D contour shaping (Sculptured FPC) • Roll-to-roll processing capability
Lead Time	Standard: Within 1 week Emergency: 3 days
Quality Standards	ISO Certifications: ISO 9001 / ISO 13485 / IATF 16949 / ISO 14001 FPC Standards: IPC-6013 (USA) / IPC/JPCA (Japan) / TPCA (Taiwan) Safety: UL Certification
Factory Size	16,000+ square meters
Processing Methods	Roll-to-roll and sheet-by-sheet processing

Need help interpreting these specifications?

Our engineering team can help you determine the optimal configuration for your application. We offer comprehensive DFM analysis (DFMEA), material consultation, and technical feedback to reduce risk and optimize yield.

Request Free DFM Analysis

MANUFACTURING EXCELLENCE

Advanced Manufacturing Capabilities

What sets our factory apart in flexible PCB manufacturing

Complete In-House Manufacturing Control

End-to-End Production

As a dedicated flex PCB manufacturer, we offer end-to-end control over production, unlike brokers or trading companies. Our 16,000+ square meter facility and advanced equipment ensure precision, quality, and customization for every project.

Direct communication with production engineers

Full in-house capabilities from raw material to final inspection

No middleman delays or quality inconsistencies

Rigid-Flex PCB Technology

Hybrid Circuit Solutions

Advanced hybrid technology combining rigid PCB sections for component mounting with flexible circuits for dynamic bending. Eliminates connectors and reduces assembly complexity in a single integrated structure.

Configuration: 2-12 layers with customizable rigid-flex stack-ups

Design advantage: Eliminates connectors, reduces size and weight by up to 60%

Enhanced reliability: 87% fewer interconnection points for superior durability

Applications: Aerospace systems, medical devices, consumer electronics, automotive sensors, military equipment

Long-Format Flex PCB Capability

From Ultra-Miniature to 4 Meters

Our dedicated workshops and advanced equipment enable us to produce a wide range of flexible PCBs, from ultra-miniature micro Flex PCBs to long-format designs.

Standard: Up to 1.6 meters

Specialized applications: Up to 4 meters

Roll-to-roll processing for seamless construction

Applications: Automotive harnesses, industrial sensors, LED lighting systems

Ultra-Thin Flex Technology

Down to 25 Microns

Advanced R&D capabilities including ultra-thin designs with overall thickness as thin as 25 micron with gold plating on Double Sided Flex PCB.

Industry-leading thin flex manufacturing

Ideal for wearables and medical implants

Maintains electrical performance in extreme miniaturization

TPU Circuit Innovation

Next-Generation Stretchable Electronics

Breakthrough technology: various types of printing circuits on TPU material (completely printing circuits on TPU) for next-generation applications.

Medical-grade Thermoplastic Polyurethane substrate

PCB size: 10-600mm

Thickness: 0.15-1mm

Circuit layers: 1-2 layers

Copper foil: 18-70μm

Applications: Wearable devices, medical equipment, beauty tech gadgets

High-Density Interconnect

Precision Manufacturing

Advanced capabilities for high-density interconnect (HDI) designs with minimum line width and spacing of 0.05mm (2mil/2mil).

Minimum trace width/spacing: 0.05mm/0.05mm

Suitable for compact electronic devices

Ideal for smartphones and wearables

Thermal Management Solutions

Flexible Heat Dissipation

Pioneering breakthrough technology: flexible heat dissipation flow channels integrated into flex PCB designs.

Proprietary thermal pathway technology

Reduces device operating temperatures

Ideal for high-power LED and automotive applications

Transparent PCB Technology

≥90% Light Transmission

Revolutionary transparent PCBs with transparency ≥ 90% for optical and display integration applications.

Exceptional optical clarity

Suitable for AR/VR devices and display integration

Maintains electrical performance with transparency

ENGINEERING SUPPORT

Design for Manufacturing (DFM) Support

Comprehensive design support from concept to mass production

DFM Analysis (DFMEA)

Comprehensive Design for Manufacturing analysis to optimize your design:

Identify potential manufacturing issues before production

Evaluate design manufacturability and risks

Recommend design improvements for better yield

Reduce prototype iteration cycles

Material Consultation

Expert guidance on substrate and material selection:

Polyimide vs. FR-4 trade-offs for your application

TPU substrate recommendations for wearables

Copper weight selection for current requirements

Base material optimization for cost and performance

Technical Feedback

Collaborative engineering partnership throughout your project:

Direct communication with production engineers

Design iteration support and optimization

Yield optimization recommendations

Technical feedback to reduce risk

Engineering Partnership

Complete support from concept to mass production:

Comprehensive design support services

Material consultation for application requirementssks

Cost-benefit analysis for design changes

Ongoing technical guidance throughout production

Request Free DFM Analysis

MATERIALS GUIDE

Material & Substrate Options

Choose the right materials for your application requirements

Flexible Base Materials

Material	Key Characteristics	Typical Applications
Polyimide (PI)	High temperature resistance Excellent chemical resistance Superior mechanical properties	Automotive, aerospace, industrial, medical devices
FR-4	Standard rigid substrate Cost-effective Good electrical properties	Rigid-flex combinations, general applications
TPU (Thermoplastic Polyurethane)	Stretchable and flexible Biocompatible Chemical resistant	Wearables, medical devices, beauty tech

Copper Weights Available

Copper Foil Options

18μm (½ oz) – Ultra-thin applications
35μm (1 oz) – Standard applications
70μm (2 oz) – High current applications

Available range: 18-70μm based on your requirements

Need Material Guidance?

Our materials engineering team provides expert recommendations based on:

Application requirements and environment
Electrical and thermal specifications
Mechanical flexibility needs
Cost optimization opportunities

Material Consultation Service

Not sure which materials are right for your application? Our engineering team offers free material consultation to help you select the optimal substrate, copper weight, and construction for your specific requirements.

Schedule Material consultation

PROJECT SOLUTIONS

Custom Project Manufacturing

Tailored production solutions for your unique project requirements, from initial prototype to full-scale manufacturing

PROTOTYPING

Small Quantities

Within 1 week

Design testing & validation

QUICK-TURN

Emergency Service

3 days

Fast prototyping & urgent needs

HIGH-VOLUME

Mass Production

Custom schedule

Volume manufacturing

Production Services

Rapid Prototyping

Standard turnaround: Within 1 week

Emergency requests: 3 days

Fast iteration for design optimization

Full testing and quality control

Volume Production

High-volume manufacturing capabilities

Maintaining strict quality control throughout

Scalable production from prototypes to mass production

Flexible lead times for production planning

Processing Methods

Roll-to-roll processing: High-volume, long-format designs

Sheet-by-sheet processing: Prototypes and mixed production

Advanced equipment for both methods

Optimized for quality and efficiency

Full Assembly Services

Flex PCBA (complete assembly) services

Reduce vendor count and production delays

Minimize quality issues with integrated service

Consulting, prototyping, and engineering support