Flex PCB Manufacturing Capabilities
Technical Specifications & Engineering Support
Explore our comprehensive flexible PCB manufacturing capabilities. From detailed technical specifications to advanced processing techniques, this page serves as your complete technical reference guide for partnering with Flex Plus on your next project.
Flex PCB Manufacturing Capabilities
Technical Specifications & Engineering Support
Explore our comprehensive flexible PCB manufacturing capabilities. From detailed technical specifications to advanced processing techniques, this page serves as your complete technical reference guide for partnering with Flex Plus on your next project.
Comprehensive Manufacturing Capabilities
Detailed technical specifications for flexible and rigid-flex PCB manufacturing
| Capability | Specification |
|---|---|
| Board Type | Single-Sided FPC / Double-Sided FPC / Multilayer FPC (3-8 Layers) / Rigid-Flex PCB (2-12 Layers) / Dual-Access FPC (Bare Back FPC) / Split FPC / Sculptured FPC / TPU Circuit |
| Board Size | Standard length: Up to 1.6 meters Specialized length: Up to 4 meters TPU Circuit: 10-600mm |
| Board Thickness | TPU substrate: 0.15-1.0mm Note: Varies by product type and layer count |
| Ultra-Thin Design | Down to 25 micron with gold plating on Double-Sided Flex PCB |
| Minimum Line Width/Space | 0.05mm / 0.05mm (2mil/2mil) |
| Copper Weight | 18μm – 70μm (½ oz – 2 oz) TPU Circuit: 18-70μm copper foil |
| Base Material | Polyimide (PI) / FR-4 / Thermoplastic Polyurethane (TPU) |
| Max Layer Count | Flexible PCB: 8 layers Rigid-Flex PCB: 12 layers |
| Circuit Layers (TPU) | 1-2 layers |
| Special Features | • Flexible heat dissipation flow channels • Transparent PCB (transparency ≥ 90%) • 3D contour shaping (Sculptured FPC) • Roll-to-roll processing capability |
| Lead Time | Standard: Within 1 week Emergency: 3 days |
| Quality Standards | ISO Certifications: ISO 9001 / ISO 13485 / IATF 16949 / ISO 14001 FPC Standards: IPC-6013 (USA) / IPC/JPCA (Japan) / TPCA (Taiwan) Safety: UL Certification |
| Factory Size | 16,000+ square meters |
| Processing Methods | Roll-to-roll and sheet-by-sheet processing |
Comprehensive Manufacturing Capabilities
Detailed technical specifications for flexible and rigid-flex PCB manufacturing
| Capability | Specification |
|---|---|
| Board Type | Single-Sided FPC / Double-Sided FPC / Multilayer FPC (3-8 Layers) / Rigid-Flex PCB (2-12 Layers) / Dual-Access FPC (Bare Back FPC) / Split FPC / Sculptured FPC / TPU Circuit |
| Board Size | Standard length: Up to 1.6 meters Specialized length: Up to 4 meters TPU Circuit: 10-600mm |
| Board Thickness | TPU substrate: 0.15-1.0mm Note: Varies by product type and layer count |
| Ultra-Thin Design | Down to 25 micron with gold plating on Double-Sided Flex PCB |
| Minimum Line Width/Space | 0.05mm / 0.05mm (2mil/2mil) |
| Copper Weight | 18μm – 70μm (½ oz – 2 oz) TPU Circuit: 18-70μm copper foil |
| Base Material | Polyimide (PI) / FR-4 / Thermoplastic Polyurethane (TPU) |
| Max Layer Count | Flexible PCB: 8 layers Rigid-Flex PCB: 12 layers |
| Circuit Layers (TPU) | 1-2 layers |
| Special Features | • Flexible heat dissipation flow channels • Transparent PCB (transparency ≥ 90%) • 3D contour shaping (Sculptured FPC) • Roll-to-roll processing capability |
| Lead Time | Standard: Within 1 week Emergency: 3 days |
| Quality Standards | ISO Certifications: ISO 9001 / ISO 13485 / IATF 16949 / ISO 14001 FPC Standards: IPC-6013 (USA) / IPC/JPCA (Japan) / TPCA (Taiwan) Safety: UL Certification |
| Factory Size | 16,000+ square meters |
| Processing Methods | Roll-to-roll and sheet-by-sheet processing |
Need help interpreting these specifications?
Our engineering team can help you determine the optimal configuration for your application. We offer comprehensive DFM analysis (DFMEA), material consultation, and technical feedback to reduce risk and optimize yield.
Need help interpreting these specifications?
Our engineering team can help you determine the optimal configuration for your application. We offer comprehensive DFM analysis (DFMEA), material consultation, and technical feedback to reduce risk and optimize yield.
Advanced Manufacturing Capabilities
What sets our factory apart in flexible PCB manufacturing

Complete In-House Manufacturing Control
End-to-End Production
As a dedicated flex PCB manufacturer, we offer end-to-end control over production, unlike brokers or trading companies. Our 16,000+ square meter facility and advanced equipment ensure precision, quality, and customization for every project.

Rigid-Flex PCB Technology
Hybrid Circuit Solutions
Advanced hybrid technology combining rigid PCB sections for component mounting with flexible circuits for dynamic bending. Eliminates connectors and reduces assembly complexity in a single integrated structure.
Applications: Aerospace systems, medical devices, consumer electronics, automotive sensors, military equipment

Long-Format Flex PCB Capability
From Ultra-Miniature to 3 Meters
Our dedicated workshops and advanced equipment enable us to produce a wide range of flexible PCBs, from ultra-miniature micro Flex PCBs to long-format designs.
Applications: Automotive harnesses, industrial sensors, LED lighting systems

Ultra-Thin Flex Technology
Down to 25 Microns
Advanced R&D capabilities including ultra-thin designs with overall thickness as thin as 25 micron with gold plating on Double Sided Flex PCB.

TPU Circuit Innovation
Next-Generation Stretchable Electronics
Breakthrough technology: various types of printing circuits on TPU material (completely printing circuits on TPU) for next-generation applications.
Applications: Wearable devices, medical equipment, beauty tech gadgets

High-Density Interconnect
Precision Manufacturing
Advanced capabilities for high-density interconnect (HDI) designs with minimum line width and spacing of 0.05mm (2mil/2mil).

Thermal Management Solutions
Flexible Heat Dissipation
Pioneering breakthrough technology: flexible heat dissipation flow channels integrated into flex PCB designs.

Transparent PCB Technology
≥90% Light Transmission
Revolutionary transparent PCBs with transparency ≥ 90% for optical and display integration applications.
Advanced Manufacturing Capabilities
What sets our factory apart in flexible PCB manufacturing

Complete In-House Manufacturing Control
End-to-End Production
As a dedicated flex PCB manufacturer, we offer end-to-end control over production, unlike brokers or trading companies. Our 16,000+ square meter facility and advanced equipment ensure precision, quality, and customization for every project.

Rigid-Flex PCB Technology
Hybrid Circuit Solutions
Advanced hybrid technology combining rigid PCB sections for component mounting with flexible circuits for dynamic bending. Eliminates connectors and reduces assembly complexity in a single integrated structure.
Applications: Aerospace systems, medical devices, consumer electronics, automotive sensors, military equipment

Long-Format Flex PCB Capability
From Ultra-Miniature to 3 Meters
Our dedicated workshops and advanced equipment enable us to produce a wide range of flexible PCBs, from ultra-miniature micro Flex PCBs to long-format designs.
Applications: Automotive harnesses, industrial sensors, LED lighting systems

Ultra-Thin Flex Technology
Down to 25 Microns
Advanced R&D capabilities including ultra-thin designs with overall thickness as thin as 25 micron with gold plating on Double Sided Flex PCB.

TPU Circuit Innovation
Next-Generation Stretchable Electronics
Breakthrough technology: various types of printing circuits on TPU material (completely printing circuits on TPU) for next-generation applications.
Applications: Wearable devices, medical equipment, beauty tech gadgets

High-Density Interconnect
Precision Manufacturing
Advanced capabilities for high-density interconnect (HDI) designs with minimum line width and spacing of 0.05mm (2mil/2mil).

Thermal Management Solutions
Flexible Heat Dissipation
Pioneering breakthrough technology: flexible heat dissipation flow channels integrated into flex PCB designs.

Transparent PCB Technology
≥90% Light Transmission
Revolutionary transparent PCBs with transparency ≥ 90% for optical and display integration applications.
Design for Manufacturing (DFM) Support
Comprehensive design support from concept to mass production
DFM Analysis (DFMEA)
Comprehensive Design for Manufacturing analysis to optimize your design:
Material Consultation
Expert guidance on substrate and material selection:
Technical Feedback
Collaborative engineering partnership throughout your project:
Engineering Partnership
Complete support from concept to mass production:
Design for Manufacturing (DFM) Support
Comprehensive design support from concept to mass production
DFM Analysis (DFMEA)
Comprehensive Design for Manufacturing analysis to optimize your design:
Material Consultation
Expert guidance on substrate and material selection:
Technical Feedback
Collaborative engineering partnership throughout your project:
Engineering Partnership
Complete support from concept to mass production:
Material & Substrate Options
Choose the right materials for your application requirements
Flexible Base Materials
| Material | Key Characteristics | Typical Applications |
|---|---|---|
| Polyimide (PI) | High temperature resistance Excellent chemical resistance Superior mechanical properties | Automotive, aerospace, industrial, medical devices |
| FR-4 | Standard rigid substrate Cost-effective Good electrical properties | Rigid-flex combinations, general applications |
| TPU (Thermoplastic Polyurethane) | Stretchable and flexible Biocompatible Chemical resistant | Wearables, medical devices, beauty tech |
Copper Weights Available
Copper Foil Options
- 18μm (½ oz) – Ultra-thin applications
- 35μm (1 oz) – Standard applications
- 70μm (2 oz) – High current applications
Available range: 18-70μm based on your requirements
Need Material Guidance?
Our materials engineering team provides expert recommendations based on:
- Application requirements and environment
- Electrical and thermal specifications
- Mechanical flexibility needs
- Cost optimization opportunities
Material & Substrate Options
Choose the right materials for your application requirements
Flexible Base Materials
| Material | Key Characteristics | Typical Applications |
|---|---|---|
| Polyimide (PI) | High temperature resistance Excellent chemical resistance Superior mechanical properties | Automotive, aerospace, industrial, medical devices |
| FR-4 | Standard rigid substrate Cost-effective Good electrical properties | Rigid-flex combinations, general applications |
| TPU (Thermoplastic Polyurethane) | Stretchable and flexible Biocompatible Chemical resistant | Wearables, medical devices, beauty tech |
Copper Weights Available
Copper Foil Options
- 18μm (½ oz) – Ultra-thin applications
- 35μm (1 oz) – Standard applications
- 70μm (2 oz) – High current applications
Available range: 18-70μm based on your requirements
Need Material Guidance?
Our materials engineering team provides expert recommendations based on:
- Application requirements and environment
- Electrical and thermal specifications
- Mechanical flexibility needs
- Cost optimization opportunities
Material Consultation Service
Not sure which materials are right for your application? Our engineering team offers free material consultation to help you select the optimal substrate, copper weight, and construction for your specific requirements.
Material Consultation Service
Not sure which materials are right for your application? Our engineering team offers free material consultation to help you select the optimal substrate, copper weight, and construction for your specific requirements.
Custom Project Manufacturing
Tailored production solutions for your unique project requirements, from initial prototype to full-scale manufacturing
PROTOTYPING
Small Quantities
Within 1 week
Design testing & validation
QUICK-TURN
Emergency Service
3 days
Fast prototyping & urgent needs
HIGH-VOLUME
Mass Production
Custom schedule
Volume manufacturing
Production Services
Rapid Prototyping
Volume Production
Processing Methods
Full Assembly Services
Custom Project Manufacturing
Tailored production solutions for your unique project requirements, from initial prototype to full-scale manufacturing
PROTOTYPING
Small Quantities
Within 1 week
Design testing & validation
QUICK-TURN
Emergency Service
3 days
Fast prototyping & urgent needs
HIGH-VOLUME
Mass Production
Custom schedule
Volume manufacturing
